SOP-OPS-04: PC Build, Component Traceability & Burn-in Testing

1. Purpose

To define the controlled process for custom gaming PC builds, ensuring full component traceability, assembly quality, stress testing, and formal release approval prior to dispatch.

2. Scope

Applies to all custom-built gaming PCs assembled by EZZTECH LTD, including B2C and B2B orders.

3. Roles & Responsibilities

Technician – Component allocation, assembly, configuration, and testing.

QA Reviewer – Final inspection and burn-in validation.

Operations Lead – Oversight and exception approval.

4. Procedure

1. Validate confirmed Sales Order and build specification.
2. Allocate components in Odoo (serial/batch capture where applicable).
3. Record component-to-build traceability (CPU, GPU, RAM, SSD, PSU, motherboard).
4. Assemble PC following internal build checklist.
5. Install approved operating system and drivers.
6. Conduct initial boot and hardware validation.
7. Execute burn-in stress test (minimum defined duration).
8. Monitor temperature, stability, and error logs.
9. Complete Final QA checklist.
10. QA approval prior to dispatch release.

5. Burn-in Testing Standards

• Minimum stress testing duration defined internally (CPU and GPU load).
• Temperature thresholds must remain within manufacturer safe limits.
• No system crashes, blue screens, or hardware errors permitted.
• Test logs must be stored against build reference.
• Any failure requires root cause analysis and re-test.

6. Component Traceability Requirements

• All serialised components must be recorded in Odoo.
• Batch numbers required for non-serialised components where available.
• Replacement components must update build trace record.
• Warranty linkage between component and final PC must be maintained.

7. Control Points

• No build may proceed without confirmed sales order.
• No dispatch without completed burn-in record.
• All component allocations must be system-recorded.
• QA approval mandatory prior to packaging.
• Build failure trends must be reviewed monthly.

8. Required Evidence / Records

• Sales order reference
• Component allocation record
• Assembly checklist
• Burn-in test log
• Final QA checklist
• Dispatch release confirmation

9. Risks & Mitigation

Risk: Early hardware failure → Mitigation: Mandatory burn-in testing.

Risk: Warranty disputes → Mitigation: Component traceability logging.

Risk: Build specification error → Mitigation: Sales order validation step.

Risk: Overheating issues → Mitigation: Thermal monitoring during stress test.

10. Review & Approval

Review Cycle: Quarterly

Next Review Date: 18 May 2026